Thermal Conductivity of Wood-Based Cellular Structures

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UDС

674.02

DOI:

10.37482/0536-1036-2020-1-146-153

Abstract

A physical model is developed for heating a set of laminated cellular structure formed from peeled veneer, dependences for determining its thermal conductivity under conditions of non-stationary heat transfer are proposed. It was found that for a package of 11 layers of birch veneer 2 mm thick, the thermal diffusivity is 1.93∙10–6 m²/s. Based on the fundamental theory of thermal conductivity of the wood substance, dependencies are obtained for calculating the duration of bonding of heat-insulating materials of a cellular structure. It has been established that the duration of gluing of a 22 mm thick plywood mesh slab of peeled birch veneer under pressure exposure is 14.5 minutes at a temperature of press plates 110 °C. The thermotechnical characteristics of the new wood-based cellular structure material were determined: the thermal conductivity coefficient of a cellular plywood board with a density of 530 kg/m³ was 0.081 W/(m·K), the strength under static bending of the board parallel to the fibers of the outer layers was 14 MPa, and perpendicular to the fibers was 10 MPa. The use of underutilized soft broadleaved species with low operational properties as a heat-insulating material, where high strength indicators are not required, is justified, since its thermal conductivity is two times lower than that of a similar material – solid plywood board.

Authors

A.A. Lukash, Candidate of Engineering, Assoc. Prof.
N.P. Lukutsova, Doctor of Engineering, Prof.

Affiliation

Bryansk State Technological University of Engineering, prosp. Stanke Dimitrova, 3A, Bryansk, 241037, Russian Federation; e-mail: mr.luckasch@yandex.ru, natluk58@mail.ru

Keywords

plywood cellular board, hardwood, thermal conductivity, veneer, gluing, heat exchange

For citation

Lukash A.A., Lukutsova N.P. Thermal Conductivity of Wood-Based Cellular Structures. Lesnoy Zhurnal [Russian Forestry Journal], 2020, no. 1, pp. 146–153. DOI: 10.37482/0536-1036-2020-1-146-153

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Received on June 3, 2019