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 These works are licensed under a Creative Commons Attribution 4.0 International License. V.V. Tuleiko, V.B. Snopkov Complete text of the article:Download article (pdf, 0.3MB )UDС647.815-41DOI:AbstractThe correlation of adhesive bonds and wood humidity is found. It is shown that adhesive bonds start forming after the 6– 9th minute of compression at the briquette humidity of 12…22 %. The maximum strength is achieved on the 12th minute of compression at the wood humidity of 4…10 %.AuthorsAffiliationCompression of Wood Chipboards of Increased Thickness. 3.Bonding inside Chipboard Briquette |
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